A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis

A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis

This review investigates the measurement methods employed to assess the geometry and electrical properties of through-silicon vias (TSVs) and examines the reliability issues associated with TSVs in 3D integrated circuits (ICs). Presently, measurements of TSVs primarily focus on their geometry, filli...

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Bibliographic Details
Main Authors: Jintao Wang, Fangcheng Duan, Ziwen Lv, Si Chen, Xiaofeng Yang, Hongtao Chen, Jiahao Liu
Format: Article
Language:English
Published: MDPI AG 2023-07-01
Series:Applied Sciences
Subjects:
TSV
reliability
integrated circuits
electronic packaging
Online Access:https://www.mdpi.com/2076-3417/13/14/8301

Internet

https://www.mdpi.com/2076-3417/13/14/8301

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