Effect of Thermal Aging on the Reliability of Interconnected Nano-Silver Solder Joints
Due to the growing demand for ultra-high-density integrated circuits in the integrated circuit industry, flip-chip bonding (FCB) has become the mainstream solution for chip interconnection. In flip-chip bonding (FCB), however, alloy solder is no longer adequate to meet the high heat dissipation dema...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-11-01
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| Series: | Crystals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-4352/13/12/1630 |