Ultra-high thermal stability of sputtering reconstructed Cu-based catalysts
Applications of Cu catalysts at high-temperature is a long-sought goal but limited by their serious deactivation due to low copper’s Tammann temperature. Here, the authors introduce an encapsulation layer to improve thermal stability at 800 °C by reconstructing electronic structure of Cu atoms.
| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2021-12-01
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| Series: | Nature Communications |
| Online Access: | https://doi.org/10.1038/s41467-021-27557-1 |