Formation of Nanolaminated Structure with Enhanced Thermal Stability in Copper
Nanolaminated structure with an average boundary spacing of 67 nm has been fabricated in copper by high-rate shear deformation at ambient temperature. The nanolaminated structure with an increased fraction of low angle grain boundaries exhibits a high microhardness of 2.1 GPa. The structure coarseni...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-08-01
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| Series: | Nanomaterials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-4991/11/9/2252 |