Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components
This paper presents the effect of electromigration and isothermal ageing in lead-free SAC305 (Sn3Ag0.5Cu) solder joints of chip-size surface mounted (SMD) components, where different track-to-pad joining angles define the current density in the joint. The samples were based on 0402 and 0603 size com...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785422014557 |