Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components
This paper presents the effect of electromigration and isothermal ageing in lead-free SAC305 (Sn3Ag0.5Cu) solder joints of chip-size surface mounted (SMD) components, where different track-to-pad joining angles define the current density in the joint. The samples were based on 0402 and 0603 size com...
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| Format: | Article |
| Language: | English |
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Elsevier
2022-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785422014557 |
| _version_ | 1828165008644636672 |
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| author | Dániel Straubinger Tamás Hurtony Attila Géczy |
| author_facet | Dániel Straubinger Tamás Hurtony Attila Géczy |
| author_sort | Dániel Straubinger |
| collection | DOAJ |
| description | This paper presents the effect of electromigration and isothermal ageing in lead-free SAC305 (Sn3Ag0.5Cu) solder joints of chip-size surface mounted (SMD) components, where different track-to-pad joining angles define the current density in the joint. The samples were based on 0402 and 0603 size components and were loaded for an extensive period of 4000 h with 2 and 2.5 A, respectively, in an increased temperature environment (40 °C). The solder joint reliability was assessed at selected times during the loading, with shear tests and cross-section analysis on metallurgic structures. Optical and scanning electron microscopy were used to analyse the microstructure of the solder joints. The shear strength of the solder joints was found to decrease with the increasing loading times. Intermetallic compound (IMC) was found on the 4000 h current stressed samples fracture surface, contrary to the other samples. The IMC layer thickness increased with the loading times and was slightly higher for the anode side of the current stressed components. The current stressing resulted in extensive copper dissolution from the pad and IMC layer accumulation at the component metallisation at the cathode side, affecting the reliability of the joints and pointing to electromigration. |
| first_indexed | 2024-04-12T01:36:24Z |
| format | Article |
| id | doaj.art-9a0015f6f7834a0ba518488cfaf834c6 |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-04-12T01:36:24Z |
| publishDate | 2022-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-9a0015f6f7834a0ba518488cfaf834c62022-12-22T03:53:18ZengElsevierJournal of Materials Research and Technology2238-78542022-11-0121308318Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD componentsDániel Straubinger0Tamás Hurtony1Attila Géczy2Corresponding author.; Budapest University of Technology and Economics, Faculty of Electronics Engineering and Informatics, Department of Electronics Technology, Budapest, Műegyetem Rkp. 3. H-1111 Budapest, HungaryBudapest University of Technology and Economics, Faculty of Electronics Engineering and Informatics, Department of Electronics Technology, Budapest, Műegyetem Rkp. 3. H-1111 Budapest, HungaryBudapest University of Technology and Economics, Faculty of Electronics Engineering and Informatics, Department of Electronics Technology, Budapest, Műegyetem Rkp. 3. H-1111 Budapest, HungaryThis paper presents the effect of electromigration and isothermal ageing in lead-free SAC305 (Sn3Ag0.5Cu) solder joints of chip-size surface mounted (SMD) components, where different track-to-pad joining angles define the current density in the joint. The samples were based on 0402 and 0603 size components and were loaded for an extensive period of 4000 h with 2 and 2.5 A, respectively, in an increased temperature environment (40 °C). The solder joint reliability was assessed at selected times during the loading, with shear tests and cross-section analysis on metallurgic structures. Optical and scanning electron microscopy were used to analyse the microstructure of the solder joints. The shear strength of the solder joints was found to decrease with the increasing loading times. Intermetallic compound (IMC) was found on the 4000 h current stressed samples fracture surface, contrary to the other samples. The IMC layer thickness increased with the loading times and was slightly higher for the anode side of the current stressed components. The current stressing resulted in extensive copper dissolution from the pad and IMC layer accumulation at the component metallisation at the cathode side, affecting the reliability of the joints and pointing to electromigration.http://www.sciencedirect.com/science/article/pii/S2238785422014557ElectromigrationMicrostructureReflow solderingPassive chip components |
| spellingShingle | Dániel Straubinger Tamás Hurtony Attila Géczy Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components Journal of Materials Research and Technology Electromigration Microstructure Reflow soldering Passive chip components |
| title | Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components |
| title_full | Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components |
| title_fullStr | Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components |
| title_full_unstemmed | Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components |
| title_short | Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components |
| title_sort | impact of electromigration and isothermal ageing on lead free solder joints of chip sized smd components |
| topic | Electromigration Microstructure Reflow soldering Passive chip components |
| url | http://www.sciencedirect.com/science/article/pii/S2238785422014557 |
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