Manufacturing of nanostructures with high aspect ratios using soft UV-nanoimprint lithography with bi- and trilayer resist systems

Manufacturing of nanostructures with high aspect ratios using soft UV-nanoimprint lithography with bi- and trilayer resist systems

In this contribution we introduce new multilayer (bilayer and trilayer) resist systems for the generation of nanostructures with high aspect ratios of up to 14:1 on 4-in. full wafer scale. The bilayer stack consists of a bottom resist layer (lift off polymer LOR1A) and an UV-curable top resist layer...

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Bibliographic Details
Main Authors: Thomas Handte, Nicolas Scheller, Lars Dittrich, Manuel W. Thesen, Martin Messerschmidt, Stefan Sinzinger
Format: Article
Language:English
Published: Elsevier 2022-04-01
Series:Micro and Nano Engineering
Subjects:
Soft UV-NIL
Nanofabrication
High etch selectivity
Bilayer
Trilayer
Lift-off
Online Access:http://www.sciencedirect.com/science/article/pii/S259000722200003X

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http://www.sciencedirect.com/science/article/pii/S259000722200003X

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