Assembly of Surface-Mounted Devices on Flexible Substrates by Isotropic Conductive Adhesive and Solder and Lifetime Characterization

Assembly of Surface-Mounted Devices on Flexible Substrates by Isotropic Conductive Adhesive and Solder and Lifetime Characterization

The assembly of passive components on flexible electronics is essential for the functionalization of circuits. For this purpose, adhesive bonding technology by isotropic conductive adhesive (ICA) is increasingly used in addition to soldering processes. Nevertheless, a comparative study, especially f...

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Bibliographic Details
Main Authors: Rafat Saleh, Sophie Schütt, Maximilian Barth, Thassilo Lang, Wolfgang Eberhardt, André Zimmermann
Format: Article
Language:English
Published: MDPI AG 2022-08-01
Series:Micromachines
Subjects:
bending
conductive adhesive
dynamic bending
flexible electronics
flexible circuits
passive components
Online Access:https://www.mdpi.com/2072-666X/13/8/1240

Internet

https://www.mdpi.com/2072-666X/13/8/1240

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