Heat Conduction and Cracking of Functionally Graded Materials Using an FDEM-Based Thermo-Mechanical Coupling Model

Heat Conduction and Cracking of Functionally Graded Materials Using an FDEM-Based Thermo-Mechanical Coupling Model

In this paper, the steady-state and transient heat transfer processes of functionally graded materials (FGMs) are analyzed using a coupled thermo-mechanical model in a GPU parallel multiphysics finite–discrete element software, namely MultiFracS. First, the coupled model to handle the heat transfer...

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Bibliographic Details
Main Authors: Du Han, Hongwei Fan, Chengzeng Yan, Tie Wang, Yu Yang, Sajid Ali, Gang Wang
Format: Article
Language:English
Published: MDPI AG 2022-11-01
Series:Applied Sciences
Subjects:
functionally graded materials
thermal cracking
thermal stress
composite materials
FDEM
Online Access:https://www.mdpi.com/2076-3417/12/23/12279

Internet

https://www.mdpi.com/2076-3417/12/23/12279

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