First-Principles Study of Cu Addition on Mechanical Properties of Ni<sub>3</sub>Sn<sub>4</sub>-Based Intermetallic Compounds

First-Principles Study of Cu Addition on Mechanical Properties of Ni<sub>3</sub>Sn<sub>4</sub>-Based Intermetallic Compounds

Ni–Cu under-bump metallisation (UBM) can reduce stress and improve wetting ability in technology for electronic packaging technology advances with three-dimensional integrated circuit (3D IC) devices. The bond between the Sn-based solder and Ni–Cu UBM is affected by the formation of intermetallic co...

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Bibliographic Details
Main Authors: Jinye Yao, Li Wang, Shihao Guo, Xiaofu Li, Xiangxu Chen, Min Shang, Haoran Ma, Haitao Ma
Format: Article
Language:English
Published: MDPI AG 2024-01-01
Series:Metals
Subjects:
intermetallic compounds
first-principles calculations
mechanical properties
electronic structures
Online Access:https://www.mdpi.com/2075-4701/14/1/64

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https://www.mdpi.com/2075-4701/14/1/64

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