Dividing of metal and plastic components of printed circuit boards
This paper contents one possibility of PCB separation due to the temperature due to the different thermal expansion of the metal path and the plastic from which the boards are made. Using the knowledge from the literary study and the simulation environments used, we have reached the maximum analysis...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2017-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | https://doi.org/10.1051/matecconf/201712502040 |