Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration

Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration

We investigated the screw hole position of a board level reliability (BLR) test board to improve the fatigue reliability of solder joints under thermal cycling and random vibration. We developed a finite element model of a BLR test board and derived the plastic strain energy density and 1-sigma stre...

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Bibliographic Details
Main Authors: Jisup Lee, Hyunsik Jeong, Gunhee Jang
Format: Article
Language:English
Published: MDPI AG 2024-02-01
Series:Materials
Subjects:
boundary condition
fatigue life
multi-objective optimization
solder joint
Online Access:https://www.mdpi.com/1996-1944/17/3/755

Internet

https://www.mdpi.com/1996-1944/17/3/755

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