Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration
We investigated the screw hole position of a board level reliability (BLR) test board to improve the fatigue reliability of solder joints under thermal cycling and random vibration. We developed a finite element model of a BLR test board and derived the plastic strain energy density and 1-sigma stre...
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MDPI AG
2024-02-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/17/3/755 |
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| author | Jisup Lee Hyunsik Jeong Gunhee Jang |
| author_facet | Jisup Lee Hyunsik Jeong Gunhee Jang |
| author_sort | Jisup Lee |
| collection | DOAJ |
| description | We investigated the screw hole position of a board level reliability (BLR) test board to improve the fatigue reliability of solder joints under thermal cycling and random vibration. We developed a finite element model of a BLR test board and derived the plastic strain energy density and 1-sigma stress, which are the main parameters influencing the fatigue life of solder joints under thermal cycling and random vibration, respectively. We analyzed the correlation between the screw hole position and the main parameters of the fatigue life through sensitivity analysis. By performing multi-objective optimization, we determined the screw hole position that maximizes the fatigue life of solder joints under thermal cycling and random vibration. With the optimal screw hole position, the fatigue life significantly increased under thermal cycling and random vibration compared to the BLR test board with the initial screw hole position. |
| first_indexed | 2024-03-08T03:52:55Z |
| format | Article |
| id | doaj.art-9d704db765c54efa866455a3d09e3e6c |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-08T03:52:55Z |
| publishDate | 2024-02-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-9d704db765c54efa866455a3d09e3e6c2024-02-09T15:18:00ZengMDPI AGMaterials1996-19442024-02-0117375510.3390/ma17030755Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random VibrationJisup Lee0Hyunsik Jeong1Gunhee Jang2Department of Mechanical Convergence Engineering, Hanyang University, Seoul 04763, Republic of KoreaDepartment of Mechanical Convergence Engineering, Hanyang University, Seoul 04763, Republic of KoreaDepartment of Mechanical Convergence Engineering, Hanyang University, Seoul 04763, Republic of KoreaWe investigated the screw hole position of a board level reliability (BLR) test board to improve the fatigue reliability of solder joints under thermal cycling and random vibration. We developed a finite element model of a BLR test board and derived the plastic strain energy density and 1-sigma stress, which are the main parameters influencing the fatigue life of solder joints under thermal cycling and random vibration, respectively. We analyzed the correlation between the screw hole position and the main parameters of the fatigue life through sensitivity analysis. By performing multi-objective optimization, we determined the screw hole position that maximizes the fatigue life of solder joints under thermal cycling and random vibration. With the optimal screw hole position, the fatigue life significantly increased under thermal cycling and random vibration compared to the BLR test board with the initial screw hole position.https://www.mdpi.com/1996-1944/17/3/755boundary conditionfatigue lifemulti-objective optimizationsolder joint |
| spellingShingle | Jisup Lee Hyunsik Jeong Gunhee Jang Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration Materials boundary condition fatigue life multi-objective optimization solder joint |
| title | Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration |
| title_full | Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration |
| title_fullStr | Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration |
| title_full_unstemmed | Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration |
| title_short | Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration |
| title_sort | optimization of the boundary conditions of a board level reliability test board to maximize the fatigue life of ball grid array solder joints under thermal cycling and random vibration |
| topic | boundary condition fatigue life multi-objective optimization solder joint |
| url | https://www.mdpi.com/1996-1944/17/3/755 |
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