Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs o...

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Bibliographic Details
Main Authors: Lee Carroll, Jun-Su Lee, Carmelo Scarcella, Kamil Gradkowski, Matthieu Duperron, Huihui Lu, Yan Zhao, Cormac Eason, Padraic Morrissey, Marc Rensing, Sean Collins, How Yuan Hwang, Peter O’Brien
Format: Article
Language:English
Published: MDPI AG 2016-12-01
Series:Applied Sciences
Subjects:
photonics packaging
silicon photonics
integrated optics
optoelectronics
photonic integrated circuits (PICs)
Online Access:http://www.mdpi.com/2076-3417/6/12/426

Internet

http://www.mdpi.com/2076-3417/6/12/426

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