Non‐contact and anti‐interference diagnosis of SiC MOSFET module bond wire faults for EV wireless charging device
Abstract SiC MOSFET modules are widely used for bidirectional wireless charging of electric vehicles. However, prolonged use can result in bond wire faults, leading to reliability issues. To address this problem, a non‐contact bond wire monitoring method that can be carried out using the charging co...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2023-11-01
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| Series: | IET Power Electronics |
| Subjects: | |
| Online Access: | https://doi.org/10.1049/pel2.12569 |