A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging

A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging

This paper presents the fabrication and characterization of a resonant pressure microsensor based on SOI-glass wafer-level vacuum packaging. The SOI-based pressure microsensor consists of a pressure-sensitive diaphragm at the handle layer and two lateral resonators (electrostatic excitation and capa...

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Bibliographic Details
Main Authors: Bo Xie, Yonghao Xing, Yanshuang Wang, Jian Chen, Deyong Chen, Junbo Wang
Format: Article
Language:English
Published: MDPI AG 2015-09-01
Series:Sensors
Subjects:
resonant pressure sensor
differential frequency output
vacuum packaging
anodic bonding
wire interconnection
mask-free metallization
Online Access:http://www.mdpi.com/1424-8220/15/9/24257

Internet

http://www.mdpi.com/1424-8220/15/9/24257

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