Decreasing Shear Stresses of the Solder Joints for Mechanical and Thermal Loads by Topological Optimization
A methodology for obtaining the optimal structure and distribution for the gradient properties of a material in order to reduce the stress level in a soldered joint was constructed. The developed methodology was based on a combination of topological optimization methods (the moving asymptotes method...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-04-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/13/8/1862 |