Enhancing thermal conductivity and balancing mechanical properties of 3D-printed iPP/HDPE-based dielectric composites via the introduction of hybrid fillers and tailored crystalline structure

Enhancing thermal conductivity and balancing mechanical properties of 3D-printed iPP/HDPE-based dielectric composites via the introduction of hybrid fillers and tailored crystalline structure

With the development of 5G technology, the miniaturised and highly integrated electronic devices urgently require thermal management materials possessing high thermal conductivity and mechanical properties. In this work, isotactic polypropylene (iPP)/high-density polyethylene (HDPE)-based dielectric...

Full description

Bibliographic Details
Main Authors: Tao Yang, Jie Leng, Jiewei Hu, Pengbo Wang, Mariya Edeleva, Ludwig Cardon, Zheng Yan, Tao Wang, Jie Zhang
Format: Article
Language:English
Published: Taylor & Francis Group 2023-12-01
Series:Virtual and Physical Prototyping
Subjects:
polymer-matrix composites
hybrid fillers
crystalline structure
thermal properties
mechanical properties
Online Access:http://dx.doi.org/10.1080/17452759.2023.2230215

Internet

http://dx.doi.org/10.1080/17452759.2023.2230215

Similar Items