Effect of Co particle content on microstructure and properties of SnBi/Cu joints

Effect of Co particle content on microstructure and properties of SnBi/Cu joints

The microstructure of Sn35Bi-xCo(x=0%, 0.3%, 0.7%, 1.0%, 1.2%, 1.5%, mass fraction) composite solder/Cu joints was observed by scanning electron microscopy (SEM).Combined energy spectrum (EDS) and XRD analysis, the difference of joint structure was studied. The mechanical properties of joints were t...

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Bibliographic Details
Main Authors: LI Zhengbing, LI Haitao, GUO Yile, CHEN Yiping, CHENG Donghai, HU Dean, GAO Junhao, LI Dongyang
Format: Article
Language:zho
Published: Journal of Materials Engineering 2022-07-01
Series:Cailiao gongcheng
Subjects:
sn35bi solder
co particle
wettability
microstructure
mechanical property
Online Access:http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2020.001151

Internet

http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2020.001151

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