Effect of Co particle content on microstructure and properties of SnBi/Cu joints
The microstructure of Sn35Bi-xCo(x=0%, 0.3%, 0.7%, 1.0%, 1.2%, 1.5%, mass fraction) composite solder/Cu joints was observed by scanning electron microscopy (SEM).Combined energy spectrum (EDS) and XRD analysis, the difference of joint structure was studied. The mechanical properties of joints were t...
Main Authors: | LI Zhengbing, LI Haitao, GUO Yile, CHEN Yiping, CHENG Donghai, HU Dean, GAO Junhao, LI Dongyang |
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Format: | Article |
Language: | zho |
Published: |
Journal of Materials Engineering
2022-07-01
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Series: | Cailiao gongcheng |
Subjects: | |
Online Access: | http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2020.001151 |
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