Controlling the Amount of Copper Formate Shells Surrounding Cu Flakes via Wet Method and Thermo-Compression Sinter Bonding between Cu Finishes in Air Using <i>Flakes</i>
To bond a semiconductor power chip on a substrate using the formation of bondlines exhibiting long-term mechanical durability at high temperatures such as 300 °C, compression-assisted sinter bonding between Cu finishes was carried out at 300–350 °C in air. Cu flakes of approximately 7 µm were used a...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-08-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/13/9/1516 |