Investigation of material removal characteristics of Si (100) wafer during linear field atmospheric-pressure plasma etching
Atmospheric-pressure (AP) plasma etching provides an alternative method for mechanical grinding to realize wafer thinning of Si wafer. It can avoid the damages and micro-cracks that would be introduced by mechanical stress during the grinding process. In this study, the material removal characterist...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2020-12-01
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| Series: | Nanotechnology and Precision Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2589554020300295 |