Influence Study of Etching Time for Porous Silicon on Morphological, Optical, Electrical and Spectral Responsivity Properties

In this investigation, n-type (100) silicon wafers with a thickness of 600 ± 25 μm and resistance of 0.1-100 μΩ were used to manufacture porous silicon. With the aid of hydrofluoric acid (HF) with a 20% concentration, a current density of 20 mA/cm2, and various experimental drilling times of 5, 15,...

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Bibliographic Details
Main Authors: Aliyaa A. Urabe, Uday M. Nayef, Randa Kamel
Format: Article
Language:Arabic
Published: Al-Mustansiriyah University 2023-06-01
Series:Mustansiriyah Journal of Science
Subjects:
Online Access:https://mjs.uomustansiriyah.edu.iq/index.php/MJS/article/view/1223