Undeformed chip thickness characteristics in grain-workpiece contact zone in ultrasonic vibration assisted grinding

To accurately describe the undeformed chip thickness characteristics in ultrasonic vibration assisted grinding, the grain space and grain protrusion height of a metal bond multi-layer diamond wheel were measured. According to the particle trajectory equation of ultrasonic vibration assisted grinding...

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Bibliographic Details
Main Authors: Kun ZHANG, Zhen YIN, Chenwei DAI, Qing MIAO, Qihui CHENG
Format: Article
Language:zho
Published: Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd. 2022-02-01
Series:Jin'gangshi yu moliao moju gongcheng
Subjects:
Online Access:http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2021.0109