Finite Element Simulation of Graphene Thermal Conductivity Framework
With the rapid development of electronic devices towards miniaturization and high integration, the problem of overheating and heat dissipation forces people to find thermal conductive materials with good comprehensive properties to meet the needs of development. Inspired by the three-dimensional bor...
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| Format: | Article |
| Language: | English |
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EDP Sciences
2022-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | https://www.matec-conferences.org/articles/matecconf/pdf/2022/05/matecconf_msms2022_01065.pdf |