Microstructure refinement mechanisms in undercooled solidification of binary and ternary nickel based alloys
Molten glass purification and cycle superheating technologies were used to make Ni65Cu35, Ni65Cu33Co2 and Ni65Cu31Co4 alloys obtain maximum undercoolings of 320 K, 292 K and 300 K respectively. In order to analyze the relationship between morphological characteristics of solidification front and und...
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| Format: | Article |
| Idioma: | English |
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Elsevier
2023-05-01
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| Col·lecció: | Journal of Materials Research and Technology |
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| Accés en línia: | http://www.sciencedirect.com/science/article/pii/S2238785423004660 |
| _version_ | 1827920372054360064 |
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| author | Xiaolong Xu Yongchao Hao Qi Wu Ruifeng Dong Yuhong Zhao Hua Hou |
| author_facet | Xiaolong Xu Yongchao Hao Qi Wu Ruifeng Dong Yuhong Zhao Hua Hou |
| author_sort | Xiaolong Xu |
| collection | DOAJ |
| description | Molten glass purification and cycle superheating technologies were used to make Ni65Cu35, Ni65Cu33Co2 and Ni65Cu31Co4 alloys obtain maximum undercoolings of 320 K, 292 K and 300 K respectively. In order to analyze the relationship between morphological characteristics of solidification front and undercooling change during migration of solid–liquid interface, a high-speed camera was used to capture pictures of the recalescence process. Observing the microstructure of the undercooled alloys using metallographic microscope, the characteristics and evolution of microstructure during rapid solidification process of undercooled liquids were analyzed. It was found that grain refinement mechanisms of highly undercooled Ni–Cu–Co alloys was the same as those of the Ni–Cu alloys. Dendrite remelting leads to the grain refinement at low undercooling, while the dominant factor of grain refinement at high undercooling is recrystallization process induced by stress. The internal driving force can be divided into two parts: one is the thermal stress generated by the releasing of solidification latent heat during recalescence process, and the other is the stress and strain accumulated by interaction of liquid flow and primary dendrite during rapid solidification. We also found that addition of third element Co not only played an important role in solidification rate and recalescence effect, but also significantly improved the average hardness of grain refined microstructure, which was about 80% higher than that of as cast alloy. The addition of trace Co was also conducive to the formation of non-segregation solidification microstructure. |
| first_indexed | 2024-03-13T04:10:34Z |
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| id | doaj.art-a103c50d68a3428fa27e9cddbc8575ba |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-13T04:10:34Z |
| publishDate | 2023-05-01 |
| publisher | Elsevier |
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| series | Journal of Materials Research and Technology |
| spelling | doaj.art-a103c50d68a3428fa27e9cddbc8575ba2023-06-21T06:55:28ZengElsevierJournal of Materials Research and Technology2238-78542023-05-0124737758Microstructure refinement mechanisms in undercooled solidification of binary and ternary nickel based alloysXiaolong Xu0Yongchao Hao1Qi Wu2Ruifeng Dong3Yuhong Zhao4Hua Hou5School of Materials Science and Engineering, North University of China, Taiyuan 030051, PR China; Collaborative Innovation Center of Ministry of Education and Shanxi Province for High-performance Al/Mg Alloy Materials, Taiyuan 030051, PR China; State Key Laboratory of Solidifification Processing, Northwestern Polytechnical University, Xi'an, Shaanxi 710072, PR China; Corresponding author.School of Materials Science and Engineering, North University of China, Taiyuan 030051, PR ChinaSchool of Materials Science and Engineering, North University of China, Taiyuan 030051, PR ChinaSchool of Materials Science and Engineering, North University of China, Taiyuan 030051, PR ChinaSchool of Materials Science and Engineering, North University of China, Taiyuan 030051, PR China; Collaborative Innovation Center of Ministry of Education and Shanxi Province for High-performance Al/Mg Alloy Materials, Taiyuan 030051, PR China; Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing 100083, PR China; Corresponding author.School of Materials Science and Engineering, North University of China, Taiyuan 030051, PR China; Collaborative Innovation Center of Ministry of Education and Shanxi Province for High-performance Al/Mg Alloy Materials, Taiyuan 030051, PR China; School of Materials Science and Engineering, Taiyuan University of Science and Technology, Taiyuan 030024, ChinaMolten glass purification and cycle superheating technologies were used to make Ni65Cu35, Ni65Cu33Co2 and Ni65Cu31Co4 alloys obtain maximum undercoolings of 320 K, 292 K and 300 K respectively. In order to analyze the relationship between morphological characteristics of solidification front and undercooling change during migration of solid–liquid interface, a high-speed camera was used to capture pictures of the recalescence process. Observing the microstructure of the undercooled alloys using metallographic microscope, the characteristics and evolution of microstructure during rapid solidification process of undercooled liquids were analyzed. It was found that grain refinement mechanisms of highly undercooled Ni–Cu–Co alloys was the same as those of the Ni–Cu alloys. Dendrite remelting leads to the grain refinement at low undercooling, while the dominant factor of grain refinement at high undercooling is recrystallization process induced by stress. The internal driving force can be divided into two parts: one is the thermal stress generated by the releasing of solidification latent heat during recalescence process, and the other is the stress and strain accumulated by interaction of liquid flow and primary dendrite during rapid solidification. We also found that addition of third element Co not only played an important role in solidification rate and recalescence effect, but also significantly improved the average hardness of grain refined microstructure, which was about 80% higher than that of as cast alloy. The addition of trace Co was also conducive to the formation of non-segregation solidification microstructure.http://www.sciencedirect.com/science/article/pii/S2238785423004660UndercoolingRecalescenceNi–Cu–Co ternary AlloyGrain refinementRecrystallization |
| spellingShingle | Xiaolong Xu Yongchao Hao Qi Wu Ruifeng Dong Yuhong Zhao Hua Hou Microstructure refinement mechanisms in undercooled solidification of binary and ternary nickel based alloys Journal of Materials Research and Technology Undercooling Recalescence Ni–Cu–Co ternary Alloy Grain refinement Recrystallization |
| title | Microstructure refinement mechanisms in undercooled solidification of binary and ternary nickel based alloys |
| title_full | Microstructure refinement mechanisms in undercooled solidification of binary and ternary nickel based alloys |
| title_fullStr | Microstructure refinement mechanisms in undercooled solidification of binary and ternary nickel based alloys |
| title_full_unstemmed | Microstructure refinement mechanisms in undercooled solidification of binary and ternary nickel based alloys |
| title_short | Microstructure refinement mechanisms in undercooled solidification of binary and ternary nickel based alloys |
| title_sort | microstructure refinement mechanisms in undercooled solidification of binary and ternary nickel based alloys |
| topic | Undercooling Recalescence Ni–Cu–Co ternary Alloy Grain refinement Recrystallization |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423004660 |
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