Improvement Prediction on the Dynamic Performance of Epoxy Composite Used in Packaging by Using Nano-Particle Reinforcements in Addition to 2-Hydroxyethyl Methacrylate Toughener

Epoxy with low viscosity and good fluidity before curing has been widely applied in the packaging of electronic and electrical devices. Nevertheless, its low flexibility and toughness renders the requirement of property improvement before it can be widely acceptable in dynamic loading applications....

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Bibliographic Details
Main Authors: Chih-Ming Chen, Huey-Ling Chang, Chun-Ying Lee
Format: Article
Language:English
Published: MDPI AG 2021-07-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/14/15/4193