Improvement Prediction on the Dynamic Performance of Epoxy Composite Used in Packaging by Using Nano-Particle Reinforcements in Addition to 2-Hydroxyethyl Methacrylate Toughener
Epoxy with low viscosity and good fluidity before curing has been widely applied in the packaging of electronic and electrical devices. Nevertheless, its low flexibility and toughness renders the requirement of property improvement before it can be widely acceptable in dynamic loading applications....
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-07-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/14/15/4193 |