Impact of Stress and Dimension on Nanosheet Deformation during Channel Release of Gate-All-Around Device

Impact of Stress and Dimension on Nanosheet Deformation during Channel Release of Gate-All-Around Device

In this paper, nanosheet deformation during channel release has been investigated and discussed in Gate-All-Around (GAA) transistors. Structures with different source/drain size and stacked Si nanosheet lengths were designed and fabricated. The experiment of channel release showed that the stress ca...

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Bibliographic Details
Main Authors: Jingwen Yang, Kun Chen, Dawei Wang, Tao Liu, Xin Sun, Qiang Wang, Ziqiang Huang, Zhecheng Pan, Saisheng Xu, Chen Wang, Chunlei Wu, Min Xu, David Wei Zhang
Format: Article
Language:English
Published: MDPI AG 2023-03-01
Series:Micromachines
Subjects:
Gate-All-Around (GAA)
stress
nanosheet length
channel release
nanosheet deformation
Online Access:https://www.mdpi.com/2072-666X/14/3/611

Internet

https://www.mdpi.com/2072-666X/14/3/611

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