Impact of Stress and Dimension on Nanosheet Deformation during Channel Release of Gate-All-Around Device
In this paper, nanosheet deformation during channel release has been investigated and discussed in Gate-All-Around (GAA) transistors. Structures with different source/drain size and stacked Si nanosheet lengths were designed and fabricated. The experiment of channel release showed that the stress ca...
Main Authors: | Jingwen Yang, Kun Chen, Dawei Wang, Tao Liu, Xin Sun, Qiang Wang, Ziqiang Huang, Zhecheng Pan, Saisheng Xu, Chen Wang, Chunlei Wu, Min Xu, David Wei Zhang |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-03-01
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Series: | Micromachines |
Subjects: | |
Online Access: | https://www.mdpi.com/2072-666X/14/3/611 |
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