Fabrication of 30 µm Sn Microbumps by Electroplating and Investigation of IMC Characteristics on Shear Strength
In this paper, we prepared a pure Sn microbump with a diameter of 30 µm using an electroplating method for a solder cap on a Cu post/Ni barrier and then determined its IMC characteristics and shear strength according to reflow recovery. In order to secure uniformity of the bump height, it was optimi...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-12-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/12/1/144 |