Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation

Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation

Liquid crystal polymer (LCP) has gained wide interest in the electronics industry largely due to its flexibility, stable insulation and dielectric properties and chip integration capabilities. Recently, LCP has also been investigated as a biocompatible substrate for the fabrication of multielectrode...

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Detaylı Bibliyografya
Asıl Yazarlar: Anna Pak, Kambiz Nanbakhsh, Ole Hölck, Riina Ritasalo, Maria Sousa, Matthias Van Gompel, Barbara Pahl, Joshua Wilson, Christine Kallmayer, Vasiliki Giagka
Materyal Türü: Makale
Dil:English
Baskı/Yayın Bilgisi: MDPI AG 2022-03-01
Seri Bilgileri:Micromachines
Konular:
flexible bioelectronics
thin-film encapsulation (TFE)
liquid crystal polymer (LCP)
atomic layer deposition (ALD)
Parylene-C (ParC)
long-term encapsulation
Online Erişim:https://www.mdpi.com/2072-666X/13/4/544

Internet

https://www.mdpi.com/2072-666X/13/4/544

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