Aluminium-Silicon Lightweight Thermal Management Alloys with Controlled Thermal Expansion

Aluminium-Silicon Lightweight Thermal Management Alloys with Controlled Thermal Expansion

With the ever-growing emphasis on global decarbonization and rapid increases in the power densities of electronics equipment in recent years, new methods and lightweight materials have been developed to manage heat load as well as interfacial stresses associated with coefficient of thermal expansion...

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Bibliographic Details
Main Authors: Peter Lewis, Andrew Tarrant, Andreas Frehn, Fritz Grensing, James Nicholson, Nick Farrah, Martyn Acreman
Format: Article
Language:English
Published: MDPI AG 2024-05-01
Series:Crystals
Subjects:
CTE
heatsink
HIP
hypereutectic
mechanical alloying
metal matrix composite
Online Access:https://www.mdpi.com/2073-4352/14/5/455

Internet

https://www.mdpi.com/2073-4352/14/5/455

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