Study on the preparation process and sintering performance of doped nano-silver paste
After tin–lead solders are banned, the widely used electronic packaging interconnect materials are tin–silver, tin–copper, and other alloy solders. With the application of high-power devices, traditional solders can no longer meet the new requirements. Nano-silver (Ag) paste, as a new solder substit...
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| Format: | Article |
| Language: | English |
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De Gruyter
2022-12-01
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| Series: | Reviews on Advanced Materials Science |
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| Online Access: | https://doi.org/10.1515/rams-2022-0273 |