Advanced Electronic Packaging Technology: From Hard to Soft
Packaging is a pivotal step in electronic device manufacturing, determining the translational performance of bare chips [...]
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-03-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/16/6/2346 |