Experimental evaluation on the silicon mechanical performance of electronic packaging
Semiconductor packaging is trending towards a miniaturisation in size but an increase in functionality. Hence, the thickness of the silicon wafer has decreased dramatically with a concern on the possible degradation of the strength of the thinned wafer. In this paper, 3point bend (3PB) on bare silic...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Universiti Malaysia Pahang Publishing
2017-03-01
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| Series: | Journal of Mechanical Engineering and Sciences |
| Subjects: | |
| Online Access: | https://journal.ump.edu.my/jmes/article/view/7991 |