Prediction of Statistical Distribution on Nanosheet FET by Geometrical Variability Using Various Machine Learning Models
Due to the aggressive scaling down of logic semiconductors, the difficulty of semiconductor component processes has increased. As the structure of components becomes more complex, the time and cost of processes and simulations have risen. Machine learning is now being used to analyze the electrical...
Main Authors: | , , , , , , , |
---|---|
Format: | Article |
Language: | English |
Published: |
IEEE
2023-01-01
|
Series: | IEEE Access |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/10310203/ |