Microassembly on silicon board for accelerometer
The paper presents microassembly design and technology for accelerometer, carried out on a silicon plate with three commutation levels and thin film resistors on both of its surfaces.
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| Format: | Article |
| Language: | English |
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Politehperiodika
2013-10-01
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| Series: | Tekhnologiya i Konstruirovanie v Elektronnoi Apparature |
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| Online Access: | http://www.tkea.com.ua/tkea/2013/5_2013/pdf/05.zip |