Fanless, porous graphene-copper composite heat sink for micro devices

Abstract Thermal management in devices directly affects their performance, but it is difficult to apply conventional cooling methods such as the use of cooling liquids or fans to micro devices owing to the small size of micro devices. In this study, we attempted to solve this problem by employing a...

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Bibliographic Details
Main Authors: Hokyun Rho, Yea Sol Jang, Hyojung Bae, An-Na Cha, Sang Hyun Lee, Jun-Seok Ha
Format: Article
Language:English
Published: Nature Portfolio 2021-09-01
Series:Scientific Reports
Online Access:https://doi.org/10.1038/s41598-021-97165-y