Selective Overview of 3D Heterogeneity in CMOS

As the demands for improved performance of integrated circuit (IC) chips continue to increase, while technology scaling driven by Moore’s law is becoming extremely challenging, if not impractical or impossible, heterogeneous integration (HI) emerges as an attractive pathway to further enhance perfor...

Full description

Bibliographic Details
Main Authors: Cheng Li, Zijin Pan, Xunyu Li, Weiquan Hao, Runyu Miao, Albert Wang
Format: Article
Language:English
Published: MDPI AG 2022-07-01
Series:Nanomaterials
Subjects:
Online Access:https://www.mdpi.com/2079-4991/12/14/2340