Effects of deformation and applied temperature on the microstructure and performance of industrial ultra-thin rolled Cu foil

Effects of deformation and applied temperature on the microstructure and performance of industrial ultra-thin rolled Cu foil

Five-generation communication, foldable cell phone, and wearable devices promote the development of Cu foils by applying multi-layer printed circuit board (MLPCB) and flexible printed circuit board (FPCB). However, few research focused on the combined influence of processing, defects (dislocation, s...

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Bibliographic Details
Main Authors: Zhichao Dong, Xiangyu Fei, Liu Feng, Jiwei Nie, Weijie Li, Benkui Gong
Format: Article
Language:English
Published: Elsevier 2023-03-01
Series:Journal of Materials Research and Technology
Subjects:
Rolled Cu foil
Microstructural modification
Dislocation
Grain boundary
Annealing
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423003174

Internet

http://www.sciencedirect.com/science/article/pii/S2238785423003174

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