The Simulated Effect of Adding Solder Layers on Reactive Multilayer Films Used for Joining Processes
In order to introduce new bonding methods in the area of electronic packaging a theoretical analysis was conducted, which should give substantial information about the potential of reactive multilayer systems (rms) to create sufficient local heat for joining processes between silicon chips and ceram...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-02-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/12/5/2397 |