Effect of Nano Copper on the Densification of Spark Plasma Sintered W–Cu Composites
In the present work, nano Cu (0, 5, 10, 15, 20, 25 wt.%) was added to W, and W–Cu composites were fabricated using the spark plasma sintering (S.P.S.) technique. The densification, microstructural evolution, tensile strength, micro-hardness, and electrical conductivity of the W–Cu composite samples...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-02-01
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| Series: | Nanomaterials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-4991/11/2/413 |