Interfacial microstructure evolution, growth kinetics and mechanical properties of Fe/Al dissimilar metal joints

The interfacial microstructure evolution, growth kinetics of the intermetallic compound (IMC) and mechanical properties of Fe/Al dissimilar metal joints were investigated by vacuum diffusion bonding. The results show that there is no IMC formed on the interface of the joint bonded at temperature of...

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Bibliographic Details
Main Authors: LI Peng, ZOU Cunzhu, DONG Honggang, WU Baosheng, LI Chao, YANG Yuesen, YAN Dejun
Format: Article
Language:zho
Published: Journal of Materials Engineering 2022-05-01
Series:Cailiao gongcheng
Subjects:
Online Access:http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2021.000694