Interfacial microstructure evolution, growth kinetics and mechanical properties of Fe/Al dissimilar metal joints
The interfacial microstructure evolution, growth kinetics of the intermetallic compound (IMC) and mechanical properties of Fe/Al dissimilar metal joints were investigated by vacuum diffusion bonding. The results show that there is no IMC formed on the interface of the joint bonded at temperature of...
Main Authors: | LI Peng, ZOU Cunzhu, DONG Honggang, WU Baosheng, LI Chao, YANG Yuesen, YAN Dejun |
---|---|
Format: | Article |
Language: | zho |
Published: |
Journal of Materials Engineering
2022-05-01
|
Series: | Cailiao gongcheng |
Subjects: | |
Online Access: | http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2021.000694 |
Similar Items
-
Characterization of Influences of Steel-Aluminum Dissimilar Joints with Intermediate Zinc Layer
by: Tobias Bick, et al.
Published: (2020-03-01) -
Microstructural Control of the Interface Layer for Strength Enhancement of Dissimilar Al/Cu Joints via Ni Addition during TIG Arc Brazing
by: Hiroki S. Furuya, et al.
Published: (2021-03-01) -
Rapid Joining of Commercial-Purity Ti to 304 Stainless Steel Using Joule Heating Diffusion Bonding: Interfacial Microstructure and Strength of the Dissimilar Joint
by: K. T. Suzuki, et al.
Published: (2020-12-01) -
Improving bonding strength and reliability of brazed titanium/copper dissimilar joint using vanadium interlayer
by: Liu Mengen, et al.
Published: (2023-01-01) -
A Review: Laser Welding of Dissimilar Materials (Al/Fe, Al/Ti, Al/Cu)—Methods and Techniques, Microstructure and Properties
by: Sergey Kuryntsev
Published: (2021-12-01)