Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies

Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies

This study investigated the use of distributed optical fiber sensing to measure temperature and strain during thermomechanical processes in printed circuit board (PCB) manufacturing. An optical fiber (OF) was bonded to a PCB for simultaneous measurement of temperature and strain. Optical frequency-d...

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Bibliographic Details
Main Authors: Tiago Maurício Leite, Cláudia Freitas, Roberto Magalhães, Alexandre Ferreira da Silva, José R. Alves, Júlio C. Viana, Isabel Delgado
Format: Article
Language:English
Published: MDPI AG 2023-10-01
Series:Sensors
Subjects:
demodulation
optical fiber sensors
printed circuits
strain measurement
temperature measurement
thermomechanical processes
Online Access:https://www.mdpi.com/1424-8220/23/20/8565

Internet

https://www.mdpi.com/1424-8220/23/20/8565

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