APA (7th ed.) Citation

Leite, T. M., Freitas, C., Magalhães, R., Silva, A. F. d., Alves, J. R., Viana, J. C., & Delgado, I. (2023). Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies. MDPI AG.

Chicago Style (17th ed.) Citation

Leite, Tiago Maurício, Cláudia Freitas, Roberto Magalhães, Alexandre Ferreira da Silva, José R. Alves, Júlio C. Viana, and Isabel Delgado. Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies. MDPI AG, 2023.

MLA (9th ed.) Citation

Leite, Tiago Maurício, et al. Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies. MDPI AG, 2023.