Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms

Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms

With the increasing demand for electronic products, the electronic package gradually developed toward miniaturization and high density. The most significant advantage of the Wafer-Level Package (WLP) is that it can effectively reduce the volume and footprint area of the package. An important issue i...

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Bibliographic Details
Main Authors: Qing-Hua Su, Kuo-Ning Chiang
Format: Article
Language:English
Published: MDPI AG 2022-05-01
Series:Materials
Subjects:
Wafer-Level Package (WLP)
Finite Element Analysis (FEA)
machine learning
Kernel Ridge Regression (KRR)
Cluster algorithm
Online Access:https://www.mdpi.com/1996-1944/15/11/3897

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https://www.mdpi.com/1996-1944/15/11/3897

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