PDN design optimization of micro-system based on package
As the power supply of IC chips tends to be low-voltage and high-current, the design of the Power Delivery Network(PDN) of the micro-system module is becoming more and more important, based on 2.5D Through-Silicon-Via(TSV), inverted solder, High Temperature Co-fired Ceramics(HTCC),3D stacking, etc....
Main Authors: | , , , |
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Format: | Article |
Language: | zho |
Published: |
National Computer System Engineering Research Institute of China
2023-02-01
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Series: | Dianzi Jishu Yingyong |
Subjects: | |
Online Access: | http://www.chinaaet.com/article/3000159661 |