PDN design optimization of micro-system based on package

PDN design optimization of micro-system based on package

As the power supply of IC chips tends to be low-voltage and high-current, the design of the Power Delivery Network(PDN) of the micro-system module is becoming more and more important, based on 2.5D Through-Silicon-Via(TSV), inverted solder, High Temperature Co-fired Ceramics(HTCC),3D stacking, etc....

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Bibliographic Details
Main Authors: Yuan Jinhuan, Wang Yanling, Yin Lili, Yang Qiao
Format: Article
Language:zho
Published: National Computer System Engineering Research Institute of China 2023-02-01
Series:Dianzi Jishu Yingyong
Subjects:
tsv
htcc
micro-system
pdn
package
Online Access:http://www.chinaaet.com/article/3000159661

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